Polishing compounds and methods
US5137541A · kind A · utility
11Cited by
9References
5Claims
0Family size
Inventor
Key dates
| Filing date | Mar 18, 1991 |
| Grant date | Aug 11, 1992 |
| Priority date | — |
| Expiry date | Mar 18, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D7/5004
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of cleaning and polishing a variety of porous and non-porous materials including porcelains, plastics, marble, glass, and finished wood. The polishing compound is comprised of an abrasive powder, an hydroflouric acid, and an organic solvent. The polishing compound is applied with a cloth and scouring of the surface to be cleaned and polished is accomplished with a soft cloth or with a polishing machine. The invention effectively removes scratches, stains, and blemishes from the surface to be polished and after scouring the result is a blemish free and polished surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.