Positive working polyamic acid/imide photoresist compositions and their use as dielectrics
US5138424A · kind A · utility
6Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | Aug 11, 1992 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.