Method of using molding pot having configured bottom
US5139728A · kind A · utility
3Cited by
3References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 25, 1991 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Mar 25, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2063/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus for encapsulating devices and having at least one molding pot wherein the pot has a configured bottom is used. The configured bottom serves as a shearing force against encapuslating material pellets which are pressed into the configured bottom by a plunger. The shearing force increases the fluidizing action of the pellets thereby lowering the viscosity of the encapsulating material so it easily enters cavities provided in the molding assembly and completely fills the cavities and encapsulates the devices without damage to the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.