Non-contact lead design and package
US5142450A · kind A · utility
29Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1991 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Apr 12, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe having wire bonding zones recessed from the single plane of the upper surface. Heat actuated adhesive tape sandwiched between the leadframe and a heatspreader is heated and the assembly is pressed together to bond the heatspreader to the leadframe without contacting the wire bonding zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.