Inventor · Phoenix, AZ, US

Timothy L. Olson

52Patents
13h-index
42Co-inventors
84Inventor score

Filing activity: Apr 12, 1991 → Nov 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US5278446A Reduced stress plastic package Electricity 256 Expired
US7745910B1 Semiconductor device having RF shielding and method therefor Electricity 84 Active
USD345731S Semiconductor package General 46 Expired
US7898066B1 Semiconductor device having EMI shielding and method therefor Electricity 46 Active
US9887103B2 Semiconductor device and method of adaptive patterning for panelized packaging Electricity 37 Active
US8536462B1 Flex circuit package and method Emerging Cross-Sectional Technologies 35 Active
US5142450A Non-contact lead design and package Emerging Cross-Sectional Technologies 29 Expired
US7908896B1 Biometric deadbolt lock assembly Emerging Cross-Sectional Technologies 25 Active
US5841660A Method and apparatus for modeling process control Emerging Cross-Sectional Technologies 24 Expired
US5936837A Semiconductor component having leadframe with offset ground plane Electricity 19 Expired
US9831170B2 Fully molded miniaturized semiconductor module Electricity 17 Active
US8067821B1 Flat semiconductor package with half package molding Electricity 16 Active
US8799845B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 15 Active
US8236151B1 Substrate carrier for wet chemical processing Chemistry; Metallurgy 10 Active
US8680656B1 Leadframe structure for concentrated photovoltaic receiver package Emerging Cross-Sectional Technologies 9 Active
US9196509B2 Semiconductor device and method of adaptive patterning for panelized packaging Electricity 9 Active
US9418905B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 7 Active
US9269622B2 Semiconductor device and method of land grid array packaging with bussing lines Electricity 7 Active
US5990554A Semiconductor package having isolated heatsink bonding pads Electricity 6 Expired
US5587883A Lead frame assembly for surface mount integrated circuit power package Electricity 6 Expired
US9520331B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 5 Active
US8072050B1 Semiconductor device with increased I/O leadframe including passive device Electricity 5 Active
US10373902B2 Fully molded miniaturized semiconductor module Electricity 5 Active
US8826221B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 5 Active
US8333941B1 Spray pyrolysis synthesis of mesoporous NbRuyOz as electrocatalyst supports in fuel cells Chemistry; Metallurgy 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.