Micromechanical device with a trimmable resonant frequency structure and method of trimming same
US5144184A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 26, 1990 |
| Grant date | Sep 1, 1992 |
| Priority date | — |
| Expiry date | Jan 26, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H3/013
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A micromechanical device having a frequency trimmable, resonant structure, including a semiconductor substrate forming a support frame. First and second flexures flexibly couple and support a structure within the support frame, to permit rotation with a resonant frequency about a first axis which passes through the flexures. First and second elongated openings located proximate the first and second flexures form first and second tension relief beams adjacent the flexures, for providing stress relief of the tensile forces between the resonant structure and the flexures, and for establishing and trimming the resonant frequency of the resonant structure. The resonant structure may also include first and second regions located proximate the elongated openings, the regions having a thickness which is substantially less than the thickness of the remainder of the resonant structure, to permit removal of at least a portion of the regions thereby enlarging the elongated openings and further trimming the resonant frequency of the resonant structure. Also disclosed is a method of trimming the resonant frequency of such a micromechanical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.