Thermally enhanced leadframe
US5146310A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1991 |
| Grant date | Sep 8, 1992 |
| Priority date | — |
| Expiry date | Jul 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally enhanced leadframe having heat conductive paths which thermally couple a die attach pad to thermal connection points spread out as far as possible from each other on the perimeter of the package. The area of the heat conductive path is maximized to occupy substantially all area in the package not occupied by the electrically conductive paths between the wire bond locations and the external connection points such as pins. This configuration maximizes the area of the printed circuit board which is heated thereby increasing thermal cooling efficiency. Further, the leadframe configuration maximizes the area of contact between the integrated circuit package and the heat conductive path thereby increasing the thermal conductivity between the device junctions on the integrated circuit die and the ambient through the material of the package itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.