Young I. Kwon
12Patents
8h-index
5Co-inventors
65Inventor score
Filing activity: Jul 18, 1991 → Nov 10, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5200809A | Exposed die-attach heatsink package | Electricity | 266 | Expired |
| US5332864A | Integrated circuit package having an interposer | Electricity | 264 | Expired |
| US5365409A | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe | Electricity | 50 | Expired |
| US5462624A | Embedded inter-connect frame | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5146310A | Thermally enhanced leadframe | Electricity | 16 | Expired |
| US5369550A | Method and apparatus for cooling a molded-plastic integrated-circuit package | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6251695A | Multichip module packaging process for known good die burn-in | Electricity | 11 | Expired |
| US5376756A | Wire support and guide | Electricity | 10 | Expired |
| US5430250A | Wire support and guide | Electricity | 6 | Expired |
| US9751419B2 | Vehicle wireless charging guidance system and method | Emerging Cross-Sectional Technologies | 5 | Active |
| US5317106A | Coplanar corrector ring | Electricity | 1 | Expired |
| US5497547A | Method and apparatus for cooling a molded-plastic integrated-circuit package | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.