Method for producing multi-layer ceramic substrates with oxidation resistant metalization
US5147484A · kind A · utility
17Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1991 |
| Grant date | Sep 15, 1992 |
| Priority date | — |
| Expiry date | Apr 10, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Ceramic substrates and a method for forming the ceramic substrates containing multi-level and interconnected circuit patterns of copper based conductors which are resistant to oxidation, said formation includes burn-out of binders in air. The oxidation resistant copper based conductors are composed primarily of copper and additives such as zinc, platinum and chrome.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.