David B. Goland
26Patents
8h-index
52Co-inventors
74Inventor score
Filing activity: Oct 6, 1989 → Oct 28, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5177594A | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance | Electricity | 103 | Expired |
| US5480503A | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Emerging Cross-Sectional Technologies | 89 | Expired |
| US6262390A | Repair process for aluminum nitride substrates | Chemistry; Metallurgy | 48 | Expired |
| US5981310A | Multi-chip heat-sink cap assembly | Electricity | 36 | Expired |
| US6373133B1 | Multi-chip module and heat-sink cap combination | Electricity | 19 | Expired |
| US5147484A | Method for producing multi-layer ceramic substrates with oxidation resistant metalization | Electricity | 17 | Expired |
| US5292477A | Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith | Electricity | 13 | Expired |
| US5759669A | Apparatus and method for screening green sheet with via hole using porous backing material | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5552107A | Aluminum nitride body having graded metallurgy | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5194196A | Hermetic package for an electronic device and method of manufacturing same | Electricity | 7 | Expired |
| US5763093A | Aluminum nitride body having graded metallurgy | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6096565A | Multi-layer glass ceramic module with superconductor wiring | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5932043A | Method for flat firing aluminum nitride/tungsten electronic modules | Electricity | 5 | Expired |
| US5169310A | Hermetic package for an electronic device and method of manufacturing same | Electricity | 5 | Expired |
| US6352014B1 | Method for making punches using multi-layer ceramic technology | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5552232A | Aluminum nitride body having graded metallurgy | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6002951A | Multi-layer ceramic substrate having high TC superconductor circuitry | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5245136A | Hermetic package for an electronic device | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5682589A | Aluminum nitride body having graded metallurgy | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6004624A | Method for the controlling of certain second phases in aluminum nitride | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5635000A | Method for screening using electrostatic adhesion | Emerging Cross-Sectional Technologies | 2 | Expired |
| US5891543A | Apparatus and method for screening using electrostatic adhesion | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6652956B2 | X-ray printing personalization technique | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6200373A | Method for controlling of certain second phases in aluminum nitride | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6306528A | Method for the controlling of certain second phases in aluminum nitride | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.