Method of bonding copper and resin
US5147492A · kind A · utility
4Cited by
2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 1991 |
| Grant date | Sep 15, 1992 |
| Priority date | — |
| Expiry date | Feb 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1259
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of bonding copper and resin comprising the steps of: PA1 a) forming a layer of copper oxide on a surface of copper by oxidation of copper; PA1 b) reducing the layer of copper oxide thus formed to metallic copper with a reducing solution with the addition of an alkaline solution and a stabilizer at a controlled temperature under a circulated condition within a controlled period of time to modify its morphology; and PA1 c) forming a layer of copper oxide on a surface of the metallic copper by baking; and PA1 d) bonding the surface of the copper oxide formed by the baking and a resin together by heat-pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.