Micromechanical tilt sensor
US5148604A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 1991 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | May 17, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/086
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor for measurement of tilt or inclination angle features a sensor element made from a monocrystalline silicon wafer, from which is etched at least one movable silicon mass. The silicon mass is freed from the surrounding wafer by an etch groove which completely penetrates the silicon wafer, and is connected to the silicon wafer by two bars lying in a common axis, so that, upon flexing or torsioning of the bars, the silicon mass is movable or rotatable about the axis of the bars. The sensor element is connected with an upper and/or a lower cover. On at least one of the covers, adjacent the silicon mass, at least two electrodes are placed. The silicon mass and the two electrodes form a pair of capacitances, and the movement or excursion of the silicon mass is detected by evaluation of the difference between the capacitances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.