Lead frames for use in plastic mold type semiconductor devices
US5153706A · kind A · utility
9Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1991 |
| Grant date | Oct 6, 1992 |
| Priority date | — |
| Expiry date | Mar 28, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a lead frame for use in a plastic mold type semiconductor device having a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame and for supporting the die pad, a plurality of leads whose inner ends of the leads are disposed around the die pad and the leads have inner leads portions which are portions to be sealed in a mold, metal plated region applied only to cover the inner lead and opposite end portions of the the die pad respectively confronting the inner leads, but the tie bar is not plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.