Aluminum nitride multi-chip module
US5155661A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1991 |
| Grant date | Oct 13, 1992 |
| Priority date | — |
| Expiry date | May 15, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module is configured using an aluminum nitride, or AlN, multi-chip substrate, sandwiched chip side down under an extruded aluminum convection cooled heat sink. An alignment ring includes grooves for control of z-axis elastomeric conductors slightly compressed between the chip connection surface of the substrate and the top surface of a PCB to provide the interconnections therebetween. The alignment ring includes a stopper portion which controls the height of the heat sink above the PCB as well as a smaller rail portion which controls the height of the substrate above the PCB. The good thermal conductivity, ruggedness and relatively good TCE match of the AlN substrate to the silicon chips permits a convenient, dense and thermally rugged MCM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.