Inventor · Fremont, CA, US

Kim Hong Chen

41Patents
14h-index
30Co-inventors
81Inventor score

Filing activity: May 15, 1991 → May 27, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US5585671A Reliable low thermal resistance package for high power flip clip ICs Electricity 68 Expired
US8519537B2 3D semiconductor package interposer with die cavity Electricity 67 Active
US5199165A Heat pipe-electrical interconnect integration method for chip modules Emerging Cross-Sectional Technologies 63 Expired
US5155661A Aluminum nitride multi-chip module Electricity 59 Expired
US5426405A Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects Electricity 46 Expired
US6191478A Demountable heat spreader and high reliability flip chip package assembly Electricity 40 Expired
US5161090A Heat pipe-electrical interconnect integration for chip modules Electricity 35 Expired
US9076754B2 3DIC packages with heat sinks attached to heat dissipating rings Electricity 24 Active
US9224673B2 Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices Emerging Cross-Sectional Technologies 22 Active
US9583415B2 Packages with thermal interface material on the sidewalls of stacked dies Electricity 21 Active
US9780072B2 3D semiconductor package interposer with die cavity Electricity 20 Active
US9269694B2 Packages with thermal management features for reduced thermal crosstalk and methods of forming same Electricity 16 Active
US9595506B2 Packages with thermal management features for reduced thermal crosstalk and methods of forming same Electricity 16 Active
US9385095B2 3D semiconductor package interposer with die cavity Electricity 15 Active
US9082743B2 3DIC packages with heat dissipation structures Electricity 14 Active
US10157818B2 Methods of cooling packaged semiconductor devices Emerging Cross-Sectional Technologies 14 Active
US10461009B2 3DIC packaging with hot spot thermal management features Electricity 14 Active
US10332823B2 Packaged semiconductor devices Emerging Cross-Sectional Technologies 14 Active
US8865521B2 3D semiconductor package interposer with die cavity Electricity 14 Active
US10062665B2 Semiconductor packages with thermal management features for reduced thermal crosstalk Electricity 11 Active
US6817884B1 Multi-I/O-port-41-channel connector Electricity 9 Expired
US9735082B2 3DIC packaging with hot spot thermal management features Electricity 9 Active
US6698646B2 Room temperature gold wire bonding Electricity 8 Expired
US9941251B2 3DIC packages with heat dissipation structures Electricity 6 Active
US9502383B2 3D integrated circuit package processing with panel type lid Electricity 6 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.