Tape automated bonding packaged semiconductor device incorporating a heat sink
US5157478A · kind A · utility
53Cited by
11References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1991 |
| Grant date | Oct 20, 1992 |
| Priority date | — |
| Expiry date | Dec 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.