Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers
US5162047A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1991 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Nov 12, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to this invention, a method of transferring a plurality of semiconductor wafers between a carrier and a support ring type boat comprises the steps of picking up the semiconductor wafer from the carrier on a station by an arm in a substantially horizontal state, positioning the wafer supported by the arm above a support ring of the boat, positioning a receiver below the support ring, moving the receiver upward to a position where a pin of the receiver reaches the arm through an opening of the support ring, lifting the wafer from the arm by the pin, moving the arm backward from the boat, moving the receiver downward to a position where the wafer is transferred from the receiver to the support ring, and then loading the boat into a heat treatment furnace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.