Inventor · Aikawa, JP

Hirofumi Kitayama

14Patents
13h-index
30Co-inventors
74Inventor score

Filing activity: Aug 11, 1989 → Dec 10, 2001

Most-cited inventions

PatentTitleAreaCited byStatus
US7235137B2 Conductor treating single-wafer type treating device and method for semi-conductor treating Chemistry; Metallurgy 712 Expired
US5217501A Vertical wafer heat treatment apparatus having dual load lock chambers Electricity 79 Expired
US5110248A Vertical heat-treatment apparatus having a wafer transfer mechanism Electricity 71 Expired
US5445486A Substrate transferring apparatus Emerging Cross-Sectional Technologies 67 Expired
US5162047A Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers Emerging Cross-Sectional Technologies 58 Expired
US4989540A Apparatus for reaction treatment Emerging Cross-Sectional Technologies 42 Expired
US5316472A Vertical boat used for heat treatment of semiconductor wafer and vertical heat treatment apparatus Chemistry; Metallurgy 35 Expired
US6210482A Apparatus for feeding gases for use in semiconductor manufacturing Emerging Cross-Sectional Technologies 35 Expired
US6095806A Semiconductor wafer boat and vertical heat treating system Emerging Cross-Sectional Technologies 29 Expired
USD378823S Wafer boat General 26 Expired
US5622639A Heat treating apparatus Chemistry; Metallurgy 24 Expired
US6360762B1 Method for feeding gases for use in semiconductor manufacturing Emerging Cross-Sectional Technologies 17 Expired
US5030056A Substrate transfer device Emerging Cross-Sectional Technologies 16 Expired
US5445521A Heat treating method and device Mechanical Engineering; Lighting; Heating 10 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.