Method and apparatus for applying solder flux
US5164022A · kind A · utility
4Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Feb 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an apparatus for depositing flux onto a solder work surface, a chamber having a plurality of openings therein is heated by means of a U-shaped current conducting heating element within which the flux chamber resides. This heating element heats the flux within the chamber until it vaporizes and is forced from the chamber through the openings onto the solder work surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.