Laser-based system for material deposition and removal
US5164565A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Apr 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laser-based repair system provides for material removal and deposition using a repair tool having a first laser operating at a high power for cutting signal lines and operating at a lower power for ablating a target repair area in conjunction with a liquid dispensing apparatus for application of the liquid solution in a target area, and a second laser for decomposing the liquid solution in an applied layer prior to the ablation of material in the target repair area. Various repair processes can be undertaken. The invention allows high-speed material deposition and removal on a surface. In a specific embodiment of the invention, the liquid solution used is a palladium acetate and a solvent or other metallo-organic solution which is capable of pyrolytic reaction and decomposition to an electrically conductive residue. A liquid applicator or dispensing apparatus is provided which is suited to applying fine traces of liquid without clogging. An optical head is provided which project beams from a plurality of lasers and surface illumination along a common axis with an optical viewing system for lighting a target workpiece for observing the repair in progress. The invention is particul…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.