Electronic package having a non-oxide ceramic bonded to metal and method for making
US5164885A · kind A · utility
9Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1991 |
| Grant date | Nov 17, 1992 |
| Priority date | — |
| Expiry date | Nov 21, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A non-oxide ceramic (16) for electronic packages and a method of producing electronic packages using a non-oxide ceramic is provided. In accordance with the present invention, the non-oxide ceramic (16) is coated with silicon dioxide (15) and a bonding glass (14) having diboron trioxide is used to attach other package components such as semiconductor chips (18), leadframes (13), and heatsinks (11) to the non-oxide ceramic (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.