James E. Drye
11Patents
6h-index
10Co-inventors
63Inventor score
Filing activity: May 25, 1984 → Mar 31, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5198963A | Multiple integrated circuit module which simplifies handling and testing | Electricity | 106 | Expired |
| US4630096A | High density IC module assembly | Electricity | 94 | Expired |
| US4722914A | Method of making a high density IC module assembly | Emerging Cross-Sectional Technologies | 32 | Expired |
| US4592794A | Glass bonding method | Electricity | 10 | Expired |
| US5164885A | Electronic package having a non-oxide ceramic bonded to metal and method for making | Emerging Cross-Sectional Technologies | 9 | Expired |
| US4515898A | Glass bonding means and method | Electricity | 7 | Expired |
| US4890156A | Multichip IC module having coplanar dice and substrate | Electricity | 6 | Expired |
| US4800421A | Glass bonding means and method | Electricity | 6 | Expired |
| US4792533A | Coplanar die to substrate bond method | Electricity | 5 | Expired |
| US6906406B2 | Multiple dice package | Electricity | 4 | Expired |
| US7969164B2 | Method and apparatus for mini module EMI shielding evaluation | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.