Method of additive circuitization of circuit boards with high adhesion, voidless copper leads
US5166037A · kind A · utility
18Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1991 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Feb 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/184
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing, imaging, developing the photoresist for additive circuitization, and forming a pattern of copper circuitization on the so exposed portions of the package. In order to avoid the formation of deleterious air bubbles on the exposed walls of the imaged and developed resist, the panel is exposed to and wetted by a liquid mist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.