Manufacturing method for semiconductor device
US5166099A · kind A · utility
30Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1991 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Sep 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for a semiconductor device in which an electrode of a semiconductor chip is electrically connected to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape. Bonding is performed with inner lead droop controlled to no more than 80 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.