Ceramic electronic package design
US5168344A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1990 |
| Grant date | Dec 1, 1992 |
| Priority date | — |
| Expiry date | Aug 15, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features: PA0 a) a flat monolithic dielectric base, the base having a flat upper surface and a flat lower surface; PA0 b) a zone on the upper surface, in which zone the HDMI device would reside; PA0 c) a seal ring surrounding the zone; PA0 d) a cover adapted to be hermetically sealed to the seal ring, thereby protecting the HDMI device located in the zone; PA0 e) a plurality of conductive vias (inner vias) extending from the upper surface inside said zone downwardly toward the lower surface; PA0 f) a plurality of perimeter conductive lead pads located on or in the upper surface about the perimeter of the zone inside the seal ring; wherein PA1 (1) the perimeter lead pads are electrically connected to the inner vias, and PA1 (2) the inner vias are electrically connected to a surface of the base outside the zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.