Inventor · Columbia, MD, US

Jack H. Enloe

11Patents
7h-index
7Co-inventors
48Inventor score

Filing activity: Jan 27, 1988 → Aug 22, 1991

Most-cited inventions

PatentTitleAreaCited byStatus
US5168344A Ceramic electronic package design Electricity 45 Expired
US4920640A Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates Emerging Cross-Sectional Technologies 21 Expired
US5073526A Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite Emerging Cross-Sectional Technologies 19 Expired
US5164345A Al.sub.2 O.sub.3 /B.sub.4 C/SiC composite Chemistry; Metallurgy 16 Expired
US5211786A Use of permeable materials to improve hot pressing process Electricity 14 Expired
US5200249A Via metallization for AlN ceramic electronic package Emerging Cross-Sectional Technologies 13 Expired
US5102749A Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite Emerging Cross-Sectional Technologies 12 Expired
US5250130A Replica hot pressing technique Electricity 6 Expired
US5346751A Electronic package using closed pore composites Emerging Cross-Sectional Technologies 5 Expired
US5017434A Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite Emerging Cross-Sectional Technologies 5 Expired
US5028650A Boron nitride sheets Electricity 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.