Heat curable blends of silicone polymide and epoxy resin
US5169911A · kind A · utility
8Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1992 |
| Grant date | Dec 8, 1992 |
| Priority date | — |
| Expiry date | Feb 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat curable dielectric compositions are provided comprising blends of silicone polyimide and epoxy resin and an effective amount of an arylonium salt such as a diaryliodoniumhexafluoroantimonate in combination with a free radical generating aromatic compound as a cocatalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.