Thomas Bert Gorczyca
60Patents
19h-index
69Co-inventors
87Inventor score
Filing activity: Jul 27, 1981 → Feb 17, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5703400A | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Emerging Cross-Sectional Technologies | 163 | Expired |
| US5161093A | Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive | Electricity | 157 | Expired |
| US5546654A | Vacuum fixture and method for fabricating electronic assemblies | Emerging Cross-Sectional Technologies | 152 | Expired |
| US6242282A | Circuit chip package and fabrication method | Electricity | 130 | Expired |
| US6396153B2 | Circuit chip package and fabrication method | Electricity | 123 | Expired |
| US5757072A | Structure for protecting air bridges on semiconductor chips from damage | Electricity | 99 | Expired |
| US5472539A | Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components | Electricity | 76 | Expired |
| US6800373B2 | Epoxy resin compositions, solid state devices encapsulated therewith and method | Emerging Cross-Sectional Technologies | 73 | Expired |
| US5567657A | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Emerging Cross-Sectional Technologies | 66 | Expired |
| US5302547A | Systems for patterning dielectrics by laser ablation | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6284564A | HDI chip attachment method for reduced processing | Electricity | 45 | Expired |
| US6368410B1 | Semiconductor processing article | Chemistry; Metallurgy | 44 | Expired |
| US5561085A | Structure for protecting air bridges on semiconductor chips from damage | Electricity | 35 | Expired |
| US7776236B2 | Index contrast enhanced optical waveguides and fabrication methods | Physics | 33 | Expired |
| US7400809B2 | Optical waveguide devices and method of making the same | Physics | 32 | Expired |
| US5300812A | Plasticized polyetherimide adhesive composition and usage | Electricity | 31 | Expired |
| US5492586A | Method for fabricating encased molded multi-chip module substrate | Emerging Cross-Sectional Technologies | 30 | Expired |
| US4728697A | Novel copolyamideimides, prepolymers therefor and method for their preparation | Electricity | 24 | Expired |
| US6255137A | Method for making air pockets in an HDI context | Electricity | 19 | Expired |
| US6935792B2 | Optoelectronic package and fabrication method | Electricity | 16 | Expired |
| US6602739B1 | Method for making multichip module substrates by encapsulating electrical conductors and filling gaps | Electricity | 15 | Expired |
| US6977057B2 | Embossing process | Physics | 15 | Expired |
| US6067931A | Thermal processor for semiconductor wafers | Electricity | 12 | Expired |
| US6303193A | Process for fabricating a tool used in electrochemical machining | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4360633A | Coating solution of polyetherimide oligomers | Emerging Cross-Sectional Technologies | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.