Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
US5170929A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1992 |
| Grant date | Dec 15, 1992 |
| Priority date | — |
| Expiry date | May 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to the acoustic transducer means for monitoring the ultrasonic signal from the ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.