Krishna Seshan
55Patents
17h-index
47Co-inventors
80Inventor score
Filing activity: Mar 14, 1989 → Aug 17, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6162652A | Process for sort testing C4 bumped wafers | Electricity | 114 | Expired |
| US5298784A | Electrically programmable antifuse using metal penetration of a junction | Electricity | 71 | Expired |
| US7034402B1 | Device with segmented ball limiting metallurgy | Electricity | 54 | Expired |
| US6521996B1 | Ball limiting metallurgy for input/outputs and methods of fabrication | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6352940B1 | Semiconductor passivation deposition process for interfacial adhesion | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6377457B1 | Electronic assembly and cooling thereof | Electricity | 39 | Expired |
| US6046101A | Passivation technology combining improved adhesion in passivation and a scribe street without passivation | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6163065A | Energy-absorbing stable guard ring | Electricity | 33 | Expired |
| US6876053B1 | Isolation structure configurations for modifying stresses in semiconductor devices | Electricity | 32 | Expired |
| US6137155A | Planar guard ring | Electricity | 32 | Expired |
| US6459573B1 | Mobile computer having a housing with openings for cooling | Physics | 32 | Expired |
| US5585663A | Self cooling electrically programmable fuse | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5154514A | On-chip temperature sensor utilizing a Schottky barrier diode structure | Physics | 24 | Expired |
| US5213249A | Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means | Electricity | 21 | Expired |
| US6090650A | Method to reduce timing skews in I/O circuits and clock drivers caused by fabrication process tolerances | Electricity | 20 | Expired |
| US5444287A | Thermally activated noise immune fuse | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5622892A | Method of making a self cooling electrically programmable fuse | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6577502B1 | Mobile computer having a housing with openings for cooling | Physics | 16 | Expired |
| US5614440A | Method of forming a thermally activated noise immune fuse | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6480385B2 | Electronic assembly and cooling thereof | Electricity | 14 | Expired |
| US6552425B1 | Integrated circuit package | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5170929A | Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means | Electricity | 14 | Expired |
| US6357330B1 | Method and apparatus for cutting a wafer | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7033923B2 | Method of forming segmented ball limiting metallurgy | Electricity | 12 | Expired |
| US6515358B1 | Integrated passivation process, probe geometry and probing process | Emerging Cross-Sectional Technologies | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.