Liquid metal paste for thermal and electrical connections
US5170930A · kind A · utility
104Cited by
27References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1991 |
| Grant date | Dec 15, 1992 |
| Priority date | — |
| Expiry date | Nov 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.