Forming a pattern on a substrate
US5173392A · kind A · utility
14Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1992 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Apr 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0353
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pattern is formed on a substrate by providing on the substrate a dielectric composition; defining a pattern in said dielectric; depositing metal and then micromachining the metal to provide the desired pattern on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.