Semiconductor device package and method of making such a package
US5173766A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1990 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Jun 25, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package and a method of making such a package is described. The package comprises a flexible packaging substrate having a patterned metal layer onto which a semiconductor die is attached and a patterned insulative layer attached to the metal layer. The insulative layer includes an annular epoxy-seal gap. A glob of silicone gel is deposited and cured on the die. A casting frame is connected to the metal layer of the flexible substrate on the same side as the die. A backside moisture-blocking layer of material is attached to an opposed side of the tape. The frame and the backside layer are attached to the metal layer of the flexible substrate using cross-linkable epoxy adhesives. These epoxy adhesives join through the epoxy-seal gap to define an epoxy-seal around the die. A thermoset type of molding compound is then poured into the casting frame to define a moisture resistant package body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.