Adrian Murphy
5Patents
5h-index
10Co-inventors
52Inventor score
Filing activity: Jun 25, 1990 → May 8, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5173766A | Semiconductor device package and method of making such a package | Emerging Cross-Sectional Technologies | 213 | Expired |
| US5227663A | Integral dam and heat sink for semiconductor device assembly | Emerging Cross-Sectional Technologies | 63 | Expired |
| US6117695A | Apparatus and method for testing a flip chip integrated circuit package adhesive layer | Electricity | 26 | Expired |
| US5992242A | Silicon wafer or die strength test fixture using high pressure fluid | Physics | 6 | Expired |
| US5447229A | Cot/tab protective shipping apparatus and method | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.