High density frontplane interconnection system
US5173845A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 26, 1989 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Dec 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1448
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A novel frontplane structure for use with a plurality of parallelly mounted printed circuit boards having respective sets of a plurality of electrical connectors mounted to the front edge of the printed circuit boards is disclosed in which a multi-layer printed circuit board is mounted to a sheet metal sub-chassis that includes integral injector/ejector devices which, by means of a cam action, produce a reduction in the mechanical effort required to mate the frontplane with each of the connectors contained on the plurality of printed circuit board assemblies installed into a card cage assembly or computer chassis to which the frontplane is to be connected is disclosed. A plurality of high density printed circuit connectors are mounted to the multi-layer printed circuit board for interconnecting with the sets of connectors mounted to the front edges of the printed circuit board assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.