High speed electroplating of tinplate
US5174887A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1990 |
| Grant date | Dec 29, 1992 |
| Priority date | — |
| Expiry date | May 2, 2010 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16K27/105
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.