Preflux coating composition for copper
US5176749A · kind A · utility
8Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Jun 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31714
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene and further including a dibasic acid, process for protecting the solderability of copper which is to be subjected to a heating cycle prior to soldering comprising using said preflux composition, and articles comprising printed circuits or wiring boards which have copper areas coated with said preflux composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.