Magnetic punch die retention for HTCC/LTCC fabrication
US5178051A · kind A · utility
12Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1991 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Dec 18, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Die punch apparatus including an electromagnetic die head core having a plurality of punch die retaining apertures, a plurality of magnetically attractable die punch assemblies respectively retained in the plurality of die retaining apertures, and a receiver plate core having punch receiver assemblies for receiving the punch pins of the punch die assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.