Hal D. Smith
7Patents
5h-index
8Co-inventors
48Inventor score
Filing activity: Dec 17, 1990 → Feb 21, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5055966A | Via capacitors within multi-layer, 3 dimensional structures/substrates | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5164699A | Via resistors within-multi-layer, 3 dimensional structures substrates | Electricity | 42 | Expired |
| US5438167A | Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates | Electricity | 14 | Expired |
| US5178051A | Magnetic punch die retention for HTCC/LTCC fabrication | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5318820A | HTCC/LTCC use of multiple ceramic tapes in high rate production | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5583668A | Holographic replication of copy film to hologram master | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5217216A | HTCC/LTCC substrate blanker/multi-layer collation die | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.