Pressure-reduced chamber system having a filter means
US5178638A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 19, 1991 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Jul 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The pressure-reduced chamber system of the invention includes a handling mechanism for loading and/or unloading a semiconductor wafer between a process chamber in which a plasma etching is carried out on a semiconductor wafer under a reduced pressure, and a pressure-reduced chamber. Further, the system includes an outer cover for covering the driving force transmitting section of the handling mechanism, a filter mounted to the outer cover such that it defines the inside and outside of the outer cover, and an exhaustion pump for evacuating the space region formed between the outer cover and the pressure-reduced chamber. Thus, when the space region is evacuated by the exhaustion pump, the dust generated from the driving force transmitting section of the handling mechanism is caught by the filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.