Patent · US Expired

Integrated circuit carrier having built-in circuit verification

US5180976A · kind A · utility

33Cited by
6References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 9, 1991
Grant dateJan 19, 1993
Priority date
Expiry dateSep 9, 2011

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/316
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adj…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.