System for substrate cooling in an evacuated environment
US5181556A · kind A · utility
30Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 20, 1991 |
| Grant date | Jan 26, 1993 |
| Priority date | — |
| Expiry date | Sep 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/903
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method and apparatus are disclosed using a combination of convection and conduction cooling to cool an article in an evacuated environment. A processing chamber is used which includes at least one heat sink. A flat surface of the article to be cooled is positioned within the chamber in a spaced apart facing parallel relationship to a facing surface of the heat sink. High conductivity gases are admitted into the chamber to accomplish cooling of the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.