Method for holding a strip of conductive lead frames
US5182851A · kind A · utility
6Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Nov 22, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.