Workpiece support
US5183402A · kind A · utility
13Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | May 14, 2011 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2099/0061
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus for supporting a workpiece has an enclosure, a means for reducing the pressure and a platen on which the workpiece is mounted. A heating mechanism is located within the platen and the platen is coated with a high emissivity material, which facilitates the radiative heat transfer between the platen and the workpiece. Consequently, the workpiece can be rapidly raised to a specific temperature. This apparatus is particularly applicable to the supporting of a semiconductor wafer within a vacuum system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.