Semiconductor device
US5184208A · kind A · utility
82Cited by
4References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Jan 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.