Method and apparatus for etching semiconductor wafers and developing resists
US5185056A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1991 |
| Grant date | Feb 9, 1993 |
| Priority date | — |
| Expiry date | Sep 13, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for modifying, such as etching or developing, selected areas of a wafer is disclosed including a rotatable turntable upon which a wafer having a surface to be etched is mounted. A delivery nozzle for directing modifying fluid onto the wafer surface is disposed over the wafer surface at a first location. At least one structure for removing the modifying fluid, such as a vacuum nozzle is positioned over the surface of the wafer at a second location. The modifying fluid moves across the wafer surface by centrifugal force away from the first location and is removed at the second location. The surface area of the wafer between the first and second locations is modified by the etching fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.