HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films
US5186973A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1990 |
| Grant date | Feb 16, 1993 |
| Priority date | — |
| Expiry date | Sep 13, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for depositing a thick, adherent and coherent polycrystalline diamond (PCD) film onto a metallic substrate using a deposition rate of no greater than 0.4 .mu.m per hour. The resulting PCD Film has a smooth surface finish, enhanced crystal orientation in comparision to industrial grade diamond powder particularly in the (220) and (400) directions, and excellent electrical and thermal properties. The method enables one to deposit PCD films having a thickness of at least 12 microns for applications on flat as well as curved substrates having wide use in the electronics industry. Thick PCD films of this invention have been found to be ideal for dissipating heat from radio frequency (RF) and microwave (MW) devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.