Adhesive sheets
US5187007A · kind A · utility
36Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1990 |
| Grant date | Feb 16, 1993 |
| Priority date | — |
| Expiry date | Jun 29, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.