Extremely tough thermosetting bismaleimide resin systems
US5189116A · kind A · utility
30Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1989 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Sep 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2615
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Bismaleimide resin systems containing low viscosity epoxy resins and a swellable or soluble thermoplastic when utilized to impregnate intermediate modulus carbon fiber are capable of preparing quasiisotropic composites, which, when cured, exhibit compression strengths after impact of greater than 47-50 ksi after an impact of 1500 in-lb/in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.