Linas Repecka
6Patents
5h-index
8Co-inventors
52Inventor score
Filing activity: Apr 29, 1988 → Nov 12, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6391436B1 | Manufacture of void-free laminates and use thereof | Emerging Cross-Sectional Technologies | 64 | Expired |
| US5189116A | Extremely tough thermosetting bismaleimide resin systems | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6676882B2 | Methods of hot-melt resin impregnation of 3-D, woven, textile preforms | Performing Operations; Transporting | 17 | Expired |
| US5003018A | Slurry mixing of bismaleimide resins | Chemistry; Metallurgy | 15 | Expired |
| US5747615A | Slurry-mixed heat-curable resin systems having superior tack and drape | Chemistry; Metallurgy | 6 | Expired |
| US6911175B2 | Methods of hot-melt impregnation of 3-D, woven, textile preforms | Performing Operations; Transporting | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.